based on the self-developed glass-based Tλ¥GV interposer chip, provides ultra-high♦☆∏± wiring bandwidth and low-cost solutions, ser©✔ving industries such as data center→ s, communication networks,$ and AI intelligent computing.€₩ &
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The three-dimensional waveguide photonic interc≤δonnection chip based on the s₩∞elf-developed ultrafast lase♦©Ω®r direct writing processin✘≤g technology has the advantages o♦&•γf low loss, miniaturization and easy integration,±↕ etc., and is applied to CPO high-densi"₹♠ty optical coupling, multi-coreβ fiber fan-in and fan-out, etc.
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The mode multiplexing optical chips and devic βes based on optical artificial ε"γ<intelligence neural networks and silicon-based in¶≠✘tegrated devices contribute to the tran<σsformation of next-generation optical fi♦γ←←ber communication technologie'☆s.
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Shenzhen Photonics Valley Tγπechnology Co., Ltd
Founded by a national-level high-cali≥£ber talent team introduced by Shenzhen, the comp₹∞ any is a state-level high-tech enter×£prise specializing in the resear€↓'ch, development, design, product™↑εion, and marketing of optical±©✘¶ communication chips and dev¶εices.
The TGV (Through Glass Via) glassδ÷ substrate packaging technology is₹α an innovative vertical electrica☆↔→l interconnection technolo™≠¥gy. By forming vertical micro via₩₹≤s on the glass substrate, it enables₩® high-density interconnection ÷γ >between chips, and between chips anλ®d substrates. This technolo'φgy originates from the TSV (Throug±§h Silicon Via) technology, but it uses gla↕₽ss as the substrate material, addressing♠✘✔ issues such as high loss, high✔↑ cost, and complex processes of ™♠÷traditional silicon-based interposers. The TGV t♥<πechnology has advantages such as excellent → high-frequency electrical char><&acteristics, large-sized ultra-₽>thin glass substrates, superior mecha✔©nical stability, and good thermal≤© conductivity. It is widely applied in field±♣s such as sensors, CPUs, GPUs, AI chips₽<≤★, display panels, and advanced¥♦•¥ semiconductor packaging, ¥φ <driving the innovation of high-performancΩ÷↑e computing and chip packaging technologieσ"σs.
The laser direct writing 3↓↔φ→D waveguide technology utilizes self-developed fe©γmtosecond laser direct writing equipment. ©≥"By precisely controlling the laser writi↕✔γ∑ng on the glass substrate, ©'it can achieve high-precision three-dimensi↕Ω¥onal waveguide structures. Thi"¶∞s technology has the advantages of≤ low loss, high density, and fi£®ne processing. It is capable of accurately c∏"ontrolling the propagation path of light at <πφthe micrometer level and is wiδ∞∑dely applied in fields such as optical commu∞π±γnication, sensors, and optoelectronic i±☆ntegration. It promotes the innovation and develo≤≠↓pment of optical communicationδ♦ devices and modules.
